Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods

Carrier wafers are an integral part of the temporary bonding process and their selection dictates what type of bonding and debonding methods can be employed. Photosetting adhesives require a carrier wafer that is transparent at the wavelength of light needed for curing – most common being UV radiation. Furthermore, if laser ablation is used for debonding, like the original 3M Wafer Support System, the carrier wafer must allow laser light to pass through to weaken the adhesive bond sufficiently to enable carrier wafer removal.