IMAPS - Packaging for Medical Electronics

We are pleased to invite you to the Packaging for Medical Electronics Show, where our partner ElectronMec will be presenting the latest SUSS innovations in the field.

The agenda will include a range of topics, such as integrating dispensable dryers in implantable medical devices, advancements in MEMS pressure sensors, supersonic cluster beam implantation for medical implants, and wearable sensors for cardiorespiratory monitoring. Additionally, there will be presentations on molecular diagnostics platforms, innovative catheter assembly processes, noninvasive wearable devices for treating rheumatoid arthritis, and the development of plasmonic nanomaterials for biosensing applications. Experts will also discuss smart wearable biosensing systems and the prospects for edible electronics in future biosensing technologies.

Attendees are encouraged to explore advanced solutions and products in medical electronics packaging. They will also have the opportunity to network with industry leaders and professionals and gain valuable insights from expert presentations and demonstrations.

We look forward to your participation.