Technische Publikationen
Wir verstehen die Halbleiterindustrie und ihre verwandten Märkte und kennen die Herausforderungen, denen unsere Kunden gegenüberstehen. Unsere Kompetenz ist Ihr Erfolg: Gemeinsam mit unseren Partnern bieten wir wissensbasierte Lösungen und Methoden zur Lösung von Herausforderungen und zur Entwicklung neuer Prozesse.
Unsere technischen Publikationen zu Innovationen und Trends im Bereich Equipment-Lösungen für die Halbleiterindustrie und verwandte Branchen stehen Ihnen hier zum Download zur Verfügung. Die Beiträge erscheinen außerdem in unserem Kundenmagazin "SUSS Report", das wir einmal jährlich veröffentlichen.
- 300mm Lithography and Bonding Technologies for TSV applications in Image Sensor and Memory products
- 3D Topography Mask Aligner Lithography Simulation
- Additive Reality: Drop It, and Enjoy the Greenback
- Additive Reality: Drop Placement Accuracy
- Additive Reality: Drop Your (Solder) Mask, It's Sampling Time
- Additive Reality: Drop-forging Solder Mask Thickness With Inkjet
- Additive Reality: Drops of Technology
- Additive Reality: Green Drops, White Drops or Both: Do Solder Mask and Legend Make a Good Team?
- Additive Reality: Isolated Raindrops Announce the Storm
- Additive Reality: Let's Drop a Line About PCB Cross Section
- Additive Reality: Printhead Selection or ‘Shop ‘Til You Drop’
- Additive Reality: Solder Mask Patterning at the Edge Between Drops and Bricks
- Additive Reality: Your Company Drops Open the Inkjet Printer Box, Now What?
- Advanced MEMS Manufacturing Technology
- Advanced Mask Aligner Lithography (AMALITH)
- Advanced mask aligner lithography: New illumination system
- Alignment Accuracy in a MA/BA8 Gen3 Using Substrate Conformal Imprint Lithography (SCIL)
- Application of the SUSS Angular Exposure System to Fabricate True-Chip-Size Packages for SAW Devices
- Applications of the SUSS PiXDRO LP50 inkjet printer with Fujifilm Dimatix cartridge (DMC) print heads in research and development
- Auto-Alignment Insights - Part 1
- Auto-Alignment Insights — Part 2: Case Studies
- Conformal Photoresist Coatings for High Aspect Ratio Features
- Contour Move - Edge Coating and Edge Stripping of Wafer Flats
- Developments to Improve Process Stability on the New MA200 Gen3
- Efficient Ozone, Sulfate and Ammonium Free Resist Stripping Process
- Evaluation of a Novel Exposure Concept to Enhance the Capabilities of Mask Aligner Lithography at Large Proximity Gaps
- Extending the Ruthenium Capping Layer Life Time of Extreme Ultra-Violet Lithography Photomasks in Physical Force Cleaning
- Formation of precise 2D Au particle arrays via thermally induced dewetting on pre-patterned substrates
- Full Wafer Double Sided Monolithic Lens Fabrication Using SUSS UV-Imprint Lithography & DELO Katiobond
- Functional Inkjet Printing in PCB Manufacture
- Fusion Bonding and Integrated Metrology - Technology Expansion of SUSS MicroTec's Product Range
- Half-Tone Proximity Lithography
- High Intensity UV-LED Mask Aligner for Applications in Industrial Research
- High Precision Dispense System
- Introduction of a unified equipment platform for UV initiated processes in conjunction with the application of electrostatic carriers as thin wafer handling solution
- LED Production on the SUSS MA100e Gen2 Mask Aligner
- LED Wafer Level Packaging – Motivation, Challenges and Solutions to Meet Future Cost Targets
- Latest Metal Technologies for 3D Integration and MEMS Wafer Level Bonding
- Lithographic Challenges and Solutions for 3D Interconnect
- Low-Temperature Hermetic Seal Bonding for Wafer-Level MEMS Packaging Using Submicron Gold Particles with Stencil Printing Patterning
- Metal Based Wafer Bonding Techniques for Wafer Level Packaging
- Metal Based Wafer Level Packaging
- Optimizing Spray Coater Process Parameters
- Optimizing Spray Coating Yield and Throughput
- Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling
- Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding
- Printing sub-micron structures using Talbot mask-aligner lithography with a 193 nm CW laser light source
- Reduction of Proximity Induced Corner Artifacts by Simulation Supported Process Optimization
- Ruthenium Capping Layer Preservation for 100X Clean Through pH Driven Effects
- SUSS Dispense System - Auto Calibration / Self-Learning
- SUSS SMILE Technology – Large Area Imprint. A Solution for Patterning of Micro and Nano Features
- Simulation for Advanced Mask Aligner Lithography
- Substrate Conformal Imprint Lithography of Functional Materials – Review of a BFS-Project
- Technology Trends of Microlens Imprint Lithography and Wafer Level Cameras (WLC)
- Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods
- The Future of Imaging and Inkjet Printing
- The Role of Wafer Bonding in 3D Integration and Packaging
- UV Enhanced Substrate Conformal Imprint Lithography (UV-SCIL) Technique for Photonic Crystals Patterning in LED Manufacturing
- UV-LED Lamp House – Light Source of the Future
- Wafer Level Packaging: Balancing Device Requirements and Materials Properties
- Wafer Scheduling Algorithms – Decision On The Fly with Dynamic Input Parameters
- Wafer and Die Bonding Technologies for 3D Integration
- Wafer-Level Cameras - Novel Fabrication and Packaging Technologies
- Wafer-Level Packaging Using High Force Bonding of AlGe
- Wafer-scale micro-optics fabrication
- mr-NIL210FC_XP – A very promising resist for employment of SCIL technology in high volume industrial applications