IMAPS Device Packaging Conference

Are you ready to join us at the 21st Annual Device Packaging Conference (DPC 2025), the premium event organized by the International Microelectronics Assembly and Packaging Society (IMAPS)? he 2025 conference is packed with opportunities, featuring keynotes, technical deep-dives into areas like 2D/3D integration and fan-out packaging, professional training, a global business forum, poster sessions, and evening discussions. Discover the latest developments and opportunities in the device packaging industry and don't miss out. See how our innovative solutions can help you achieve your packaging goals at our booth. We look forward to seeing you at our booth #300 and sharing our passion for packaging excellence.