Technical Publications
We understand the semiconductor industry and its related markets and know about the challenges our customers are facing. Our expertise is your success: Together with our partners, we offer knowledge-based solutions and share methods to solve challenges and develop new processes.
Our technical publications on innovations and trends in equipment solutions for the semiconductor industry and related industries are available for download here.
- Epson Partners with SUSS to Integrate PrecisionCore Printhead Technology to Print Functional materials
- SUSS’s Hybrid Bonding All-Rounder XBC300 Gen2 D2W/W2W to be added to Center for Neovation Microelectronics Fabrication Facility
- Applications of the SUSS PiXDRO LP50 inkjet printer with Fujifilm Dimatix cartridge (DMC) print heads in research and development
- Additive Reality: Let's Drop a Line About PCB Cross Section
- Additive Reality: Drop-forging Solder Mask Thickness With Inkjet
- Additive Reality: Isolated Raindrops Announce the Storm
- Additive Reality: Green Drops, White Drops or Both: Do Solder Mask and Legend Make a Good Team?
- Additive Reality: Your Company Drops Open the Inkjet Printer Box, Now What?
- Additive Reality: Drop Your (Solder) Mask, It's Sampling Time
- Additive Reality: Solder Mask Patterning at the Edge Between Drops and Bricks
- Additive Reality: Printhead Selection or ‘Shop ‘Til You Drop’
- Additive Reality: Drops of Technology
- Additive Reality: Drop It, and Enjoy the Greenback
- Additive Reality: Drop Placement Accuracy
- The Future of Imaging and Inkjet Printing
- Full Wafer Double Sided Monolithic Lens Fabrication Using SUSS UV-Imprint Lithography & DELO Katiobond
- Optimizing Spray Coater Process Parameters
- Optimizing Spray Coating Yield and Throughput
- Ruthenium Capping Layer Preservation for 100X Clean Through pH Driven Effects
- UV-LED Lamp House – Light Source of the Future
- Wafer Scheduling Algorithms – Decision On The Fly with Dynamic Input Parameters
- Developments to Improve Process Stability on the New MA200 Gen3
- Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods
- mr-NIL210FC_XP – A very promising resist for employment of SCIL technology in high volume industrial applications
- Contour Move - Edge Coating and Edge Stripping of Wafer Flats
- High Precision Dispense System
- SUSS SMILE Technology – Large Area Imprint. A Solution for Patterning of Micro and Nano Features
- Efficient Ozone, Sulfate and Ammonium Free Resist Stripping Process
- Simulation for Advanced Mask Aligner Lithography
- Reduction of Proximity Induced Corner Artifacts by Simulation Supported Process Optimization
- Wafer-Level Packaging Using High Force Bonding of AlGe
- Printing sub-micron structures using Talbot mask-aligner lithography with a 193 nm CW laser light source
- SUSS Dispense System - Auto Calibration / Self-Learning
- Application of the SUSS Angular Exposure System to Fabricate True-Chip-Size Packages for SAW Devices
- Alignment Accuracy in a MA/BA8 Gen3 Using Substrate Conformal Imprint Lithography (SCIL)
- Low-Temperature Hermetic Seal Bonding for Wafer-Level MEMS Packaging Using Submicron Gold Particles with Stencil Printing Patterning
- 3D Topography Mask Aligner Lithography Simulation
- Extending the Ruthenium Capping Layer Life Time of Extreme Ultra-Violet Lithography Photomasks in Physical Force Cleaning
- High Intensity UV-LED Mask Aligner for Applications in Industrial Research
- Auto-Alignment Insights — Part 2: Case Studies
- Substrate Conformal Imprint Lithography of Functional Materials – Review of a BFS-Project
- LED Wafer Level Packaging – Motivation, Challenges and Solutions to Meet Future Cost Targets
- Advanced Mask Aligner Lithography (AMALITH)
- Formation of precise 2D Au particle arrays via thermally induced dewetting on pre-patterned substrates
- Metal Based Wafer Bonding Techniques for Wafer Level Packaging
- Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling
- Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding
- Metal Based Wafer Level Packaging
- Wafer Level Packaging: Balancing Device Requirements and Materials Properties
- Technology Trends of Microlens Imprint Lithography and Wafer Level Cameras (WLC)
- Wafer and Die Bonding Technologies for 3D Integration
- Auto-Alignment Insights - Part 1
- 300mm Lithography and Bonding Technologies for TSV applications in Image Sensor and Memory products
- Evaluation of a Novel Exposure Concept to Enhance the Capabilities of Mask Aligner Lithography at Large Proximity Gaps
- Functional Inkjet Printing in PCB Manufacture
- Fusion Bonding and Integrated Metrology - Technology Expansion of SUSS's Product Range
- The Role of Wafer Bonding in 3D Integration and Packaging
- Lithographic Challenges and Solutions for 3D Interconnect
- UV Enhanced Substrate Conformal Imprint Lithography (UV-SCIL) Technique for Photonic Crystals Patterning in LED Manufacturing
- Advanced mask aligner lithography: New illumination system
- LED Production on the SUSS MA100e Gen2 Mask Aligner
- Half-Tone Proximity Lithography
- Conformal Photoresist Coatings for High Aspect Ratio Features
- Advanced MEMS Manufacturing Technology
- Latest Metal Technologies for 3D Integration and MEMS Wafer Level Bonding
- Introduction of a unified equipment platform for UV initiated processes in conjunction with the application of electrostatic carriers as thin wafer handling solution
- Wafer-Level Cameras - Novel Fabrication and Packaging Technologies