Mask Aligner

Highest precision for applications with thick and thin resists

The SUSS Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS designs their mask aligner systems for lithography applications in the field of 3D packaging, advanced packaging, MEMS, LED, compound semiconductors, power devices, photovoltaic, nanotechnology and wafer-level optics.

SUSS’s mask and bond alignment platforms perform high precision alignment for mask-to-wafer as well as wafer-to-wafer operations. The equipment processes substrates and wafer up to 300 mm of any kind of material and thickness. With a wide variety of additional functionality the mask aligner not only meets various process requirements but also succeeds with its flexible configuration modes.

Automated Mask Aligner

MA300 Gen3 Mask AlignerHighly Automated Platform for 300mm and 200mm Wafers

MA200 Gen3 Mask AlignerAlignment and Exposure for a Multitude of Applications

MA100/150e Gen Mask AlignerAutomated Platform for Wafers up to 100mm or 150mm

Semi-Automated Mask Aligner

MA12 Gen3 Mask AlignerSemi-automated mask aligner for wafer sizes of up to 12"/300 mm

MA8 Gen5 Mask AlignerCompact Aligner Platform for Research and Mid- to Large-Scale Production

MA/BA Gen4 Series Mask and Bond AlignerSemi-Automated Platform for Wafers up to 8"/200mm

Manual Mask Aligner

MJB4 Mask AlignerState-of-the art R&D Solution for Small Substrates and Pieces

Technologies

  • Top-side alignment (TSA)
  • Bottom-side alignment (BSA)
  • Infrared alignment (IR)
  • Proximity Lithography

Top-side alignment (TSA)

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, micro bumping, and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAlign® system invented at SUSS.

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor contrast conditions

Available for:

Automated Mask Aligner
Semi-Automated Mask Aligner
Manual Mask Aligner