Additive Reality: Drop-forging Solder Mask Thickness With Inkjet
Traditional coating processes for solder mask1 handle thickness as a single parameter for the whole board. There will be differences between the amount of material on the laminate or on the copper, and these will depend on the height of the copper and in some cases on the section of the copper feature. Overall, it is reproducible: It looks homogeneously green and it is easy to estimate the amount of material consumption. Therefore, everybody is happy.