ACS200 Gen3 TE Coater & Developer
Fully automated platform for maximum throughput
The SUSS ACS200 Gen3 TE platform takes the very successful and well-known ACS200 Gen3 platform to a new level. It increases throughput and makes operation and maintenance more comfortable. The SUSS ACS200 Gen3 TE offers unmatched configuration flexibility of modules and technologies, thus covering the requirements of Advanced Packaging, MEMS, LED, and other markets and serving R&D as well as HVM.
Highlights
- Up to 6 spinner modules
- Improved wafer handling with In Motion Centering (IMOC)
- Unmatched configuration flexibility
- Enabling inkjet for automated systems
- High operating comfort
- Standard Manufacturing Interface (SMIF) load ports
The base frame has been redesigned to enable a configuration of up to 6 spinner modules with the possibility of having plate stacks above these modules. In addition, introducing the In Motion centering (IMOC) function, which is an ‘on-the-fly’ centering while wafer handling, further boosts the overall throughput.
The platform has been updated to fulfill the latest ESD standards and offers higher comfort for operators and technicians. The second screen is configurable according to individual needs. Cameras as well as tool/module status, can be displayed, and metrology data processed. The peripheral supporting equipment has been improved significantly, and the newly introduced Flexi Media Cabinet offers tidiness and high standardization.
The platform supports the next generation of material deposition as the SUSS JETx inkjet module with PiXDRO technology is fully integrated into the tool while the capability of adding other modules is still given. Standard Manufacturing Interface (SMIF) load ports have been introduced. Furthermore, a flow controller system provides excellent dispense accuracy for solvent and developing applications.
The ACS200 Gen3 TE platform continues to offer state-of-the-art open-bowl coating and the SUSS proprietary GYRSET® closed-cover coating technology. The well-accepted bowl design remains unchanged and provides an easy process transfer from the previous platform.
