MA300 Gen3 Mask-Aligner
Highly Automated Mask Aligner Platform for 300 mm and 200 mm Wafers
SUSS's MA300 Gen3 is a highly automated mask alignment platform for 300 mm and 200 mm wafers. It is specifically designed for 3D Packaging, wafer-level packaging, and flip-chip applications but can be used as well for other technologies where geometries in the range of 4 and 100 microns have to be exposed. The MA300 Gen3 represents a new generation of mask aligners from SUSS that are designed to address the requirements of modern high-end fabs in a high-volume manufacturing environment.
Highlights
- Full-field intensity 90mW/cm² (broad band)
- Down to 2.5% Light Uniformity on 300mm
- 100 percent edge exposure flexibility (easy EBR)
- Resolution down to 4 µm in Proximity Mode
- Alignment accuracy 0.5 µm (3 sigma), with DirectAlign option
- Can be equipped with a dedicated alignment kit for creating 3D interconnects
- Best in Class Throughput
In addition to the standard topside alignment with accuracies down to 0.5 µm (DirectAlign) the new 3D dedicated alignment platform enables bottom side and infrared alignment for 300 mm based three-dimensional (3D) packaging lithography applications such as etch masks for TSVs and dicing streets, backside redistribution layers (RDLs) or bumping applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications.
Unlike steppers, proximity mask aligners are very efficient when exposing very thick layers. Mask aligners offer large process windows because they don't have the depth of focus limitations known from projection systems.
