MA200 Gen3 Mask Aligner
Alignment and Exposure for a Multitude of Applications
Specially designed for high-volume production the MA200 Gen3 mask aligner is suited for the automated processing of square substrates and wafers up to 200 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick-resist MEMS applications, 3D patterning over topography, and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.
Highlights
- Leading process stability
- Unmatched throughput for thick materials
- Process flexibility for a multitude of applications
The MA200 Gen3 offers intelligent solutions for a large range of process requirements. Its various alignment options, flexible optics, and special add-ons make it an all-purpose tool for multiple handling and processing needs.
A high level of automation, e.g. with an optional automatic filter exchange unit, shortens valuable process times and significantly reduces the cost of ownership.
Ease of use has played a major role in the design of the MA200 Gen3. Features such as an adjustable monitor and an ergonomic I/O interface, a continuous-run load port, and a direct view of the exposure stage make it comfortable to work with the MA200 Gen3 even under a high workload.
With its wide range of add-ons, the MA200 Gen3 is easily adaptable for specific applications.
