MA/BA Gen4 Pro Series Mask & Bond Aligner

Highly Versatile Mask and Bond Aligner for Industrial Research and Production

The MA/BA Gen4 Pro mask and bond aligner is the all-rounder of all SUSS MicroTec's semi-automated mask alignment equipment, and thus offers a wide range of application possibilities. It supports substrate sizes of up to 150 mm and 200 mm. Thanks to numerous tools and options, as well as settable process parameters, it offers maximum flexibility for research and development or production processes. A fully developed design and leading edge technology make the MA/BA Gen4 Pro series the ideal platform to develop future technology. Thus setting new standards for MEMS, advanced packaging, 3D integration and compound semiconductor applications.


  • High alignment precision and resolution
  • Large process range
  • Maximum process control
MA/BA Gen4 Pro Series Mask & Bond Aligner

The MA/BA Gen4 Pro series is easy to integrate into production environments and is highly compatible with SUSS MicroTec’ s automated mask aligners. Therefore, a process transfer from development to production is easily made. It stands out through its well designed functionality (it is an industry standard) and a high degree of functional automation. Automated pattern recognition and alignment supports a high production rate and low scrap rate.

High resolution optics and exposure systems as well as the most modern alignment processes make the MA/BA Gen4 Pro series a valuable tool when venturing into uncharted territory. It supports several imprint processes for micro and nanostructures. With only a little adaptation, it allows wafer-to-wafer alignment, easy fusion bonding as well as pre-process plasma treatments of the substrate surface.

Details : Alignment

  • Top-side alignment (TSA)
  • Bottom-side alignment (BSA)
  • DirectAlign®
  • Assisted Wafer and Mask Loading

Details : Exposure

  • Proximity Lithography
  • Soft Contact Exposure
  • Hard Contact Exposure
  • Vacuum Contact Exposure

Details : Exposure Optics

  • MO Exposure Optics®
  • HR and LGO optics
  • Diffraction-Reducing Optics
  • UV-LED light source

Details : Automation

  • Auto Alignment
  • Automatic Filter Change
  • Wedge Error Compensation (WEC)
  • Assisted Wafer and Mask Loading


  • Lab Simulation Software
  • Source Mask Optimization

Imprint Lithography

  • Imprint Lithography
  • Stamp Fabrication