Wafer Bonding
SUSS. Advancing the State-of-Art in Wafer Bonding
Wafer bonding is rapidly establishing itself as a pervasive technology in semiconductor manufacturing today. Wafer bonding is already a critical core competency for any high volume MEMS manufacturing operation – from accelerometers and gyros to silicon pressure sensors for automotive, biomedical, aerospace and consumer applications.
- Modern MEMS devices use wafer bonding technology for microfabrication, hermetic sealing, stress isolation and wafer level packaging using anodic, low temperature glass frit and eutectic bonding processes.[read more]
- Advanced engineered substrates, such as silicon-on-insulator (SOI) are manufactured in high volume using silicon direct wafer bonding technology.[read more]
- Next generation CMOS circuits for consumer applications will use 3-D interconnections by creating vertical electrical interconnects by using wafer to wafer bonding of CMOS device wafers.[read more]
- High brightness LED’s are manufactured today using wafer bonding technology to create metal mirror backing wafers bonded to LED wafers, to increase light emission efficiency.[read more]
Aligned wafer bonding requires precision alignment, and SUSS is a recognized world leader in precision alignment systems. Our applications staff has extensive experience in all aspects of wafer bonding technology from research and development to high volume production. Contact us to learn more about wafer bonding solutions from SUSS.
