MEMS Test

SUSS is the pioneer in wafer level test equipment for the MEMS market.

Wafer level solutions for:

SUSS MicroTec and several industrial and research partners have teamed up in a special collaboration project to develop new test techniques and equipment which enable the direct application of non-electrical input to each individual die, as well as measure non-electrical output. Examples include light, pressure, motion, acceleration, temperature and sound. The SUSS family of analytical probe systems can test MEMS at wafer level, diced or undiced, on bonded wafer components, or in their final package.

This means that device and technology development, process control and MEMS Test can be undertaken at early stages saving the manufacturer both time and money.

MEMS manufacturers who are interested are invited to join MEMUNITY, a community aimed at informing and developing about wafer level test possibilities. To find out more, visit www.memunity.org.