Failure Analysis
Analyzing the root cause of failing semiconductor devices and preventing it from recurring is a vital tool for all semiconductor manufacturing companies, ensuring not only high quality for your customers, but also improving product reliability and manufacturing yield. There is a large variety of tools and methods available for engineers to overcome the seemingly daunting task of localizing failures.
SUSS is the leading supplier of dedicated probing solutions for wafer-level failure analysis tasks. We at SUSS understand the challenges faced daily in the failure analysis lab and provide outstanding solutions for easily overcoming those challenges. Alongside traditional stand-alone probing, we also closely work together with all major vendors of failure analysis tools to integrate our probing solutions and their complex analytical machines into powerful failure analysis solutions tailored to your needs.
At SUSS, we pride ourselves having developed many unique, innovative world's firsts such as:
- A Manual, Remote-Controlled Submicron ProbeHead™ (PH400)
- Double Side Probe Systems (DSP)
- Backside Emission Probe Systems (BEP)
- A Scanning Probe System using AFM technology (AFP)
- A Non-Contact Probing System (NC-1)
- The Test Head Prober (THP100)
Our team of application experts is dedicated to providing you with the solution that will meet your needs today and well into the future, whether it is a highly-flexible manual probe system or a fully-integrated solution for emission microscopy.
