Thick Photoresists
SUSS aligners and coaters are the worldwide leading photolithography tools for thick resist processing that is commonly used for applications such as wafer bumping, or the fabrication of MEMS and Compound Semiconductor devices. SUSS coaters assure the best uniformity and coating quality when applying thick layers to the substrate. The diffraction reducing optics of the SUSS aligners are the perfect solution for patterning thick resists up 400 microns.
In the last few years resist manufacturers have introduced new chemically amplified positive tone resists that allow steeper sidewalls in thick resists. Combined with the broadband exposure of a SUSS mask aligner 90° sidewalls and a bump separation down to 5 microns can be achieved.
Main Applications
- SemiconductorsMPU, MCU, CCL, DSP, DRAM, SRAM, Flash, ASIC and other Logic, Display Drivers, Analogs, Discretes, Cameras
- Compound SemiconductorsRF, Filters, III-V/ Si-integration, Sensors FPA, Power Devices
- MEMSPressure Sensors, Accelerometers, Gyroscopes, Micro Mirrors
