C4NP
Next Generation Lead-Free and Low Cost Wafer Bumping
Features and Benefits
- Alloy independent, any solder, including Lead-Free
- Cost Effective
- High Yield
- Fine Pitch
- Less Voids
- Short Turnaround
IBM and SUSS MicroTec AG are working together to develop and commercialize IBM's next-generation,100% lead-free semiconductor packaging technology, C4NP.
C4NP (Controlled Collapse Chip Connection New Process) is a totally new first flip chip technology which is set to revolutionize the bumping process. It allows the creation of pre-patterned solder balls to be completed while a wafer is still in the front-end of a manufacturing facility, reducing cycle time significantly. The solder bumps can be inspected in advance and deposited onto the wafer in one simple step using technology similar to wafer-level bonding. The C4NP technology employs the simplicity of solder paste (stencil/screen), but instead uses pure molten alloy to produce the fine pitch capability of electroplating.
Click on the links on the left to find out more about IBM's revolutionary C4NP technology, SUSS' unique C4NP production tools as well as finding the answers to your questions.
