History
With over five decades of experience in the manufacturing of process and test equipment SUSS MicroTec has set the standards for precision and quality throughout the semiconductor industry. Continuous innovation and the ability to find new solutions for an ever-changing market have made SUSS MicroTec a technology leader.
Timeline
- 1949Karl Suess KG founded near Munich, Germany
- 1963First Mask Aligner developed
- 1970First probe system developed
- 1971Karl SUSS France founded
- 1974The World's first double-side Mask Aligner launched
- 1980Karl SUSS America founded in Waterbury, Vermont
- 1983Karl SUSS Asia founded in Bangkok, Thailand
- 1988Karl SUSS Japan founded in Yokohama, Japan
- 1989First Substrate Bonder developed
- 1990Karl SUSS Dresden founded near Dresden, Germany
- 1993SUSS purchases the French SET company which brings spin coaters and device bonders into the SUSS product portfolio. Company trades under Karl SUSS France
- 1997The world's first 300mm probing system launched
- 1998SUSS launches its highly successful production cluster principle
- 1999SUSS purchases Convac from Fairchild and renames it Karl SUSS Vaihingen
- 1999The Holding Company of the Karl SUSS Group goes public under the name of SUSS MicroTec AG
- 2001Karl SUSS subsidiaries renamed to SUSS MicroTec
- 2001Image Technologies purchased, based in Palo Alto, USA
- 2002SUSS MicroOptics founded in Neuchatel, Switzerland
- 2004SUSS enters into a Joint Development Agreement with IBM to manufacture tools for a new solder bumping process
- 2006SUSS launches the world’s fastest probe system, capable of testing an incredible 70,000 dies per hour
