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Top-to-Bottom Side Measurement

Front to Back Alignment Verification

Double side alignment and exposure is frequently used in the manufacture of MEMS, power devices, integrated optics and PCBs. Top-to-bottom side Measurement Systems from SUSS MicroTec are the ideal tool to verify the alignment of your double side alignment and exposure processes.

DSM200 Front to Back Alignment Verification

Automated System

Fully automatic cassette to cassette front-to-back alignment verification offering excellent measurement accuracy and repeatability.

DSM200

DSM8 Front to Back Alignment Verification

Manual System

Reliabilty, precision and speed make the SUSS MicroTec DSM8 the tool of choice for both the R&D and production environment.

DSM8