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NEW PRODUCT
At Semicon Korea 2009, SUSS MicroTec unveiled the second generation of its ACS300, a modular system for coating, baking and developing of wafers up to 300mm. The ACS300 Gen2 offers unmatched configuration flexibility at market-leading cost-of-ownership (CoO). The system architecture and process modules are specifically adapted to the needs of the advanced packaging and 3D integration industry, which requires very thick photo resist layers of up to 100 microns and more. Combining best in class coat and develop uniformity with exceptional edge bead performance makes the ACS300 Gen2 the preferred solution for various special spin coating applications such as thick resists or photosensitive polymers like polyimide, PBO or Cyclotene™ (BCB).